Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-04-28
1997-04-15
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
174266, H05K 342
Patent
active
056197918
ABSTRACT:
The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.
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Lambrecht, Jr. Vincent G.
Law Henry H.
Roy Apurba
Thomson, Jr. John
Wu Te-Sung
Books Glen E.
Hall Carl E.
Lucent Technologies - Inc.
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