Method for fabricating flexible pixel array substrate

Details Method for fabricating flexible pixel array substrate Method for fabricating flexible pixel array substrate

2009-06-19

2010-10-05

Bryant, Kiesha R (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S149000, C438S763000, C257SE21598, C257SE21705

Reexamination Certificate

active

07807551

ABSTRACT:
In a method for fabricating a flexible pixel array substrate, first, a release layer is formed on a rigid substrate. Next, on the release layer, a polymer film is formed, the adhesive strength between the rigid substrate and the release layer being higher than that between the release layer and the polymer film. The polymer film is formed by spin coating a polymer monomer and performing a curing process to form a polymer layer. Afterwards, a pixel array is formed on the polymer film. The polymer film with the pixel array formed thereon is separated from the rigid substrate.

REFERENCES:
patent: 6572780 (2003-06-01), McCormack et al.
patent: 6762510 (2004-07-01), Fock et al.
patent: 7045442 (2006-05-01), Maruyama et al.
“Office Action of Taiwan counterpart application”, issued on Aug. 28, 2009, p. 1-p. 8.

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