Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2009-11-05
2011-11-22
Louie, Wai Sing (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S027000, C027S021100, C027S021100, C027S021100
Reexamination Certificate
active
08062914
ABSTRACT:
Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates.
REFERENCES:
patent: 6169708 (2001-01-01), Kaneko et al.
patent: 7230271 (2007-06-01), Yamazaki et al.
patent: 7327421 (2008-02-01), Kaneko
patent: 2004/0061118 (2004-04-01), Yamazaki et al.
patent: 2004/0090588 (2004-05-01), Kim et al.
Lee Kwang Yeon
Lee Seung Kyu
Park Jae Yong
Brinks Hofer Gilson & Lione
Jahan Bilkis
LG Display Co. Ltd.
Louie Wai Sing
LandOfFree
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