Method for fabricating electronic components incorporating ceram

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156252, 264 61, 148DIG69, B32B 3126, B32B 3112

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active

056140436

ABSTRACT:
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.

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