Method for fabricating electrical connecting element

Details Method for fabricating electrical connecting element Method for fabricating electrical connecting element

2005-10-18

2005-10-18

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S846000, C029S853000

Reexamination Certificate

active

06954986

ABSTRACT:
A method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer (1) through a first conducting layer (3), which essentially covers an entire side of the substrate. The perforation depth (d) is at least equal to the total thickness of the substrate and the first conducting layer. The conductor material of the first conducting layer (3), during the piercing step, is deformed so that it partially covers the wall of the hole fabricated by the piercing process. Plating the first conducting layer with additional conductor material bridges the little remaining distance between the conductor material and the opposite side of the substrate layer.

REFERENCES:
patent: 3346950 (1967-10-01), Schick
patent: 3668762 (1972-06-01), Clark
patent: 4663840 (1987-05-01), Ubbens et al.
patent: 6601297 (2003-08-01), Schmidt
patent: 195 22 338 (1997-01-01), None
patent: 0 435 584 (1991-07-01), None
WO 99/49708, Method for Making Electrical Connections Between Conductors Separated by a Dielectric, Publication Date: Sep. 30, 1999.
WO 00/13062, Method for Producing Micro-Openings, Publication Date: Mar. 9, 2000.

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