Method for fabricating devices including polymeric materials

Details Method for fabricating devices including polymeric materials Method for fabricating devices including polymeric materials

1989-03-16

1990-12-18

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

264236, 26427213, 264347, 525482, 528 13, 526 60, C08G 5900, C08G 7310, C08G 8500

Patent

active

049787128

ABSTRACT:
A device fabrication method is disclosed in which a precursor polymeric or oligomeric material, capable of undergoing a curing reaction involving crosslinking and/or imidization, is at least partially cured and incorporated into the device being fabricated. Significantly, the at least partial curing is achieved by heating the material at generally increasing (although not necessarily continuously increasing) temperatures. In addition, the heat is supplied at a rate so that the temperature of the material is always maintained at or below the corresponding glass transition temperature of the material, which increases during the heating process.

REFERENCES:
patent: 3576933 (1971-04-01), Bates et al.
patent: 3991258 (1976-11-01), Beckingham et al.
patent: 4810438 (1989-03-01), Webster et al.
Commercial use, See p. 2.
Gillham, J. K., "Cure and Properties of Thermosetting Systems," Proc. 13th North American Thermal Analysis Soc. Conf., 9/23-26, 1984, Philadelphia, PA, pp. 344-347.
Bair, H. E., "Curing Behavior of an Epoxy Resin Above and Below Tg," Polymer Preprints, vol. 26, No. 1, Apr., 1985, pp. 10-11.

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