Method for fabricating component-embedded printed circuit board

Details Method for fabricating component-embedded printed circuit board Method for fabricating component-embedded printed circuit board

2008-06-03

2011-12-27

Ahmed, Shamim (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S017000, C216S036000

Reexamination Certificate

active

08083954

ABSTRACT:
A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal layer having the electronic component disposed thereon and the carrier plate by a dielectric film; removing the carrier plate and exposing the plating metal layer; and patterning at least one of the metal layer and the plating metal layer to be a circuit layer.

REFERENCES:
patent: 5079069 (1992-01-01), Howard et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 2006/0203456 (2006-09-01), Sohn et al.
patent: 2007/0062725 (2007-03-01), Wu et al.
patent: 2007/0275525 (2007-11-01), Das et al.

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