Method for fabricating cob type semiconductor package

Details Method for fabricating cob type semiconductor package Method for fabricating cob type semiconductor package

1998-10-26

2000-09-26

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438106, 438121, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

061241520

ABSTRACT:
Method for fabricating a COB type semiconductor package, which is suitable for simplifiing a process from wire bonding to milling, including the steps of (1) mounting chips on a COB film having a plurality of bond holes formed therein, (2) electrically connecting the chips to inside portions of the COB film through the bond holes, (3) placing a solid state EMC(Epoxy Molding Compound) on a top surface of each of the chips, and (4) heating the solid state EMC so that the EMC covers wires and the chips.

REFERENCES:
patent: 5548884 (1996-08-01), Kim
patent: 5833903 (1998-11-01), Centofante
patent: 5849609 (1998-12-01), Chun
IEEE/CPMT International Electronics Manufacturing Technology symposium p. 109-111 (1995).

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