Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-10-04
2009-11-10
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S828000, C029S847000, C029S851000, C430S311000
Reexamination Certificate
active
07614146
ABSTRACT:
The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second surfaces; a conductive pillar formed in the through hole by electroplating; and a first circuit layer and a second circuit layer respectively formed on the first and second surfaces of the carrier board, the first and second circuit layers being electrically connected to the two end portions of the conductive pillar, thereby reducing spacing between adjacent conductive pillars of the carrier board and achieving high density circuit layout.
REFERENCES:
patent: 6512186 (2003-01-01), Nishiwaki et al.
patent: 2006/0029726 (2006-02-01), Mok et al.
Banks Derris H
Le Dan D
Phoenix Precision Technology Corporation
Sawyer Law Group P.C.
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