Method for fabricating ceramic electronic parts

Details Method for fabricating ceramic electronic parts Method for fabricating ceramic electronic parts

1997-02-24

1999-06-29

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156155, 156291, 156297, 29885, B32B 3100

Patent

active

059163950

ABSTRACT:
A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.

REFERENCES:
patent: 3765431 (1973-10-01), Jannett et al.
patent: 4064606 (1977-12-01), Dunn
patent: 4192061 (1980-03-01), Masuzima et al.
patent: 4395184 (1983-07-01), Braden
patent: 4664943 (1987-05-01), Nitta et al.
patent: 5130067 (1992-07-01), Flaitz et al.
patent: 5383997 (1995-01-01), Minowa et al.
patent: 5547622 (1996-08-01), Chalasani et al.

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