Method for fabricating capacitor of semiconductor device

Semiconductor device manufacturing: process – Making passive device – Planar capacitor

Reexamination Certificate

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C438S396000

Reexamination Certificate

active

07105417

ABSTRACT:
The present invention provides a method of fabricating a capacitor for a semiconductor device. The method includes: forming sequentially a lower electrode and a dielectric layer having a high dielectric constant over a semiconductor substrate which have gone through predetermined processes; forming sequentially a first metal layer and a poly-silicon layer over the dielectric layer; forming an upper electrode pattern by pattering the poly-silicon layer and the first metal layer; forming a second metal layer covering the upper electrode pattern on an entire surface of the semiconductor substrate; and forming an upper electrode constituted with the second metal layer, the poly-silicon layer and the first metal layer by patterning the second metal layer so that the second metal layer is connected with the first metal layer.

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patent: 2001/0035550 (2001-11-01), Yamazaki et al.
patent: 000472135 (1996-02-01), None
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patent: 2001-109725 (2001-12-01), None
Wolf et al. Silicon Processing for the VLSI Era, vol. 1- Process Technology, Second Edition, Lattice Press 2000, pp. 21 219.

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