Method for fabricating ballasted finger electrode

Electrical resistors – With base extending along resistance element – Resistance element coated on base

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427101, 427103, H01C 1012

Patent

active

041941748

ABSTRACT:
A ballasted finger electrode structure is fabricated on a substrate by the steps of depositing on the substrate a layer of resistive material, forming one or more dielectric regions on the resistive layer; and forming two or more finger electrode segments spaced apart over one or more of the dielectric regions but electrically connected by the resistive region underlying the dielectric region. The result is a finger electrode structure with a precisely defined length of resistive ballasting.

REFERENCES:
patent: 3225261 (1965-12-01), Wolf
patent: 3742319 (1973-06-01), Bryan et al.
patent: 4091409 (1978-05-01), Wheatley, Jr.

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