Method for fabricating anisotropic conductive substrate

Details Method for fabricating anisotropic conductive substrate Method for fabricating anisotropic conductive substrate

2006-11-28

2006-11-28

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S840000, C029S877000, C174S08400S, C428S209000, C428S901000

Reexamination Certificate

active

07140101

ABSTRACT:
A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 μm and 250 μm. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.

REFERENCES:
patent: 5262226 (1993-11-01), Yoshida
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 6344156 (2002-02-01), Yamada et al.
patent: 6923883 (2005-08-01), Kissell et al.

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