Method for fabricating an undercoated chip electrically intercon

Details Method for fabricating an undercoated chip electrically intercon Method for fabricating an undercoated chip electrically intercon

1994-10-11

1996-12-03

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29841, 174259, 22818022, 228254, 437211, H05K 334, H05K 338, H01L 2150

Patent

active

055795730

ABSTRACT:
`
Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.

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