Etching a substrate: processes – Forming or treating electrical conductor article
Patent
1997-09-23
2000-05-09
Sergent, Rabon
Etching a substrate: processes
Forming or treating electrical conductor article
216 17, 216 75, 427 96, 438694, 438700, 438702, 438703, H01B 1300, H01B 1332, H01T 100, H01L 21764
Patent
active
060599839
ABSTRACT:
A method of fabricating an overcoated printed circuit board having a clean area free of contamination from the overcoating material. A metal-clad substrate is etched to form first and second printed circuit traces on the substrate. The first and second printed circuit traces define a channel having first and second ends. A layer of soldermask is deposited onto the substrate to cover a portion of the first and second printed circuit traces and to cover the channel except at an aperture. The aperture includes the intended clean area. The first and second printed circuit traces and the channel are covered with a capping device. An overcoating material is applied to the printed circuit board. During the applying step, the overcoating material is allowed to infiltrate into the channel under the capping device at the first and second ends, but is not allowed to reach the aperture. Counter pressure buildup inside the channel, caused by the infiltration itself, stops the overcoating material before it reaches the intended clean area. The capping device may be removed, or may remain in the assembly. Also disclosed is an application of the inventive method for forming spark gaps having various topologies, all including the just-described channel.
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Warren Boxleitner, Electrostatic Discharge And Electronic Equipment, pp. 1-7, (IEEE Press 1989).
Hewlett--Packard Company
Sergent Rabon
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