Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Patent
1997-11-13
1999-03-09
Bowers, Charles
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
H01L 21331, H01L 218222
Patent
active
058800000
ABSTRACT:
The present invention relates to an NPN transistor, the base and the emitter of which are formed within a window defined in a thick oxide according to a first substantially rectangular mask. At least a portion of the area defined by the first mask is covered with a polysilicon layer, preferably along a side of this first mask, a base contact area being formed under this polysilicon layer, the three other sides of the emitter-base area being delimited by a protection layer, an intrinsic base area, and then an emitter area covered with a doped N-type polysilicon layer, being formed in the opening thus defined.
REFERENCES:
patent: 4215418 (1980-07-01), Muramatsu
patent: 4276543 (1981-06-01), Miller et al.
patent: 5439832 (1995-08-01), Nakamura
Bowers Charles
SGS-Thomson Microelectronics S.A.
Thompson Craig
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