Method for fabricating an interposer

Details Method for fabricating an interposer Method for fabricating an interposer

2008-02-05

2009-11-10

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025350, C029S025420, C029S592100, C029S832000, C361S306200, C257S790000, C174S262000

Reexamination Certificate

active

07614142

ABSTRACT:
A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric film formed on the first electrode and a second capacitor electrode formed on the dielectric film; and forming on the primary surface of the first substrate and the capacitor a first layer as semi-cured, and a first partial electrode to be a part of a through-electrode, buried in the first resin layer and electrically connected to the first electrode or the second electrode. The method further includes cutting an upper part of the first partial electrode and an upper part of the first resin layer with a cutting tool; forming on one primary surface of a second substrate a second resin layer as semi-cured, and a second partial electrode to be a part of the through-electrode, buried in the second resin layer and disposed in alignment with the first partial electrode; cutting an upper part of the second partial electrode and an upper part of the second resin layer with a cutting tool; making thermal processing with the first resin layer and the second resin layer in close contact with each other to adhere the first resin and the second resin layer to each other while jointing the first and second partial electrodes to each other; removing the first substrate; forming on said one primary surface of the second substrate a third resin layer, covering the thin-film capacitor, burying a third partial electrode to be a part of the through-electrode in the third resin layer, supporting the third resin layer by a supporting substrate; and removing the second substrate.

REFERENCES:
patent: 5906310 (1999-05-01), Vinciarelli et al.
patent: 6376909 (2002-04-01), Forbes et al.
patent: 6894396 (2005-05-01), Shioga et al.
patent: 6961230 (2005-11-01), Otsuka et al.
patent: 7016392 (2006-03-01), Tandon et al.
patent: 7047637 (2006-05-01), deRochemont et al.
patent: 7377033 (2008-05-01), Lauffer et al.
patent: 4-211191 (1992-08-01), None
patent: 7-176453 (1995-07-01), None
patent: 2001-35990 (2001-02-01), None
patent: 2001-68583 (2001-03-01), None
patent: 2002-83892 (2002-03-01), None
patent: 3583396 (2004-08-01), None
patent: 2004-83892 (2004-10-01), None

Affiliated with

Also associated with

Rating

Method for fabricating an interposer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating an interposer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating an interposer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4121859