Method for fabricating an integrated nozzle plate and...

Details Method for fabricating an integrated nozzle plate and... Method for fabricating an integrated nozzle plate and...

2005-10-04

2005-10-04

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S039000, C216S049000, C029S890100, C438S021000

Reexamination Certificate

active

06951622

ABSTRACT:
A method for fabricating a multi-level micro-fluidic device for an micro-fluidic injection head equipped with symmetrical heaters. The method incorporates two thick photoresist deposition processes, a light-absorbing layer deposited in-between and a nickel-containing material electroplating process. The first thick photoresist deposition process is carried out to form a primary ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The light-absorbing layer is deposited to prevent overheating of the first photoresist layer during a subsequent metal seed layer sputtering process. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel-containing material electroplating process provides an orifice plate on top of the injection head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.

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patent: 6214245 (2001-04-01), Hawkins et al.
patent: 2002/0012027 (2002-01-01), Moon et al.

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