Method for fabricating an integrated circuit

Details Method for fabricating an integrated circuit Method for fabricating an integrated circuit

1996-04-24

2000-02-08

Nuzzolillo, Maria

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438690, 216 38, H01L 2100

Patent

active

060228075

ABSTRACT:
An apparatus 100 for removing surface non-uniformities is provided. This apparatus has a stage 103 for holding a substrate 127 to be processed. This substrate often includes a film thereon, where the film has the non-uniformities. The apparatus 200 includes a movable head 111, which can provide rotatable movement about a fixed axis 123. A drive motor 115 is operably attached to the movable head 111 to provide this rotatable movement. A pad 113 (e.g., polishing or planarizing pad) is attached to the movable head. This pad 113 comprises an abrasive material and also has a smaller length (e.g, diameter, etc.) relative to a length (e.g, diameter, etc.) of the substrate. The smaller pad is capable of selectively removing a portion of the non-uniformities on the film.

REFERENCES:
patent: 3979239 (1976-09-01), Walsh
patent: 4128968 (1978-12-01), Jones
patent: 4144099 (1979-03-01), Edmonds et al.
patent: 4197676 (1980-04-01), Sauerland
patent: 4232485 (1980-11-01), Eadon-Allen
patent: 4244775 (1981-01-01), D'Asaro
patent: 4358338 (1982-11-01), Downey et al.
patent: 4403453 (1983-09-01), Cave et al.
patent: 4419848 (1983-12-01), Dischert
patent: 4462860 (1984-07-01), Szmanda
patent: 4600469 (1986-07-01), Fusco et al.
patent: 4671851 (1987-06-01), Beyer et al.
patent: 4693036 (1987-09-01), Mori
patent: 4789648 (1988-12-01), Chow et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4956944 (1990-09-01), Ando et al.
patent: 5104421 (1992-04-01), Takizawa et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5508077 (1996-04-01), Chen et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5542874 (1996-08-01), Chikaki
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5599423 (1997-02-01), Parker et al.
patent: 5665201 (1997-09-01), Sahota
patent: 5672095 (1997-09-01), Morimoto et al.

Affiliated with

Also associated with

Rating

Method for fabricating an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating an integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1681124