Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-09-20
1997-03-11
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156230, 156233, 156235, 156257, 1562728, 156289, 264 61, B32B 3112, B32B 3120
Patent
active
056097042
ABSTRACT:
A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a fluorine-carbon monomolecular film release layer is formed on the surface of the thus obtained pattern, thereby forming an intaglio plate. The intaglio plate is filled with Ag paste and then dried. The intaglio plate is then laminated onto an insulating substrate, on which a thermoplastic resin layer is formed using heat rollers. Thereafter, the intaglio plate is peeled from the insulating substrate so that the pattern of the Ag paste is transferred thereon, and the conductor pattern is formed through burning. Further, an insulating layer is formed so as to cover the conductor pattern and another conductor pattern is formed on the insulating layer, whereby forming a multilayered structure. In some cases, a difference in height of the lower layer conductor pattern is provided and the higher portion thereof functions as a via hole electrode for electrically connecting the lower and upper conductor patterns. Thus, provided are a method of fabricating electronic parts which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance.
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Hayama Masaaki
Mohri Noboru
Nakao Keiichi
Matsushita Electric - Industrial Co., Ltd.
Mayes M. Curtis
Simmons David A.
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