Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1997-04-07
1999-03-30
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438108, 438118, 438125, H01L 2144, H01L 2148, H01L 2150
Patent
active
058888497
ABSTRACT:
An electronic package is fabricated by providing a thin, circuitized substrate having electrical circuitry on a first surface; and then molding a dielectric body to the first surface of the substrate. The dielectric body contains an opening for exposing a portion of the surface of the thin circuitized substrate having at least a portion of the electrical circuitry. A semiconductor device is then positioned within the opening of the molded dielectric body and is electrically coupled to at least a portion of the electrical circuitry on the exposed portion of the surface of the thin circuitized substrate. Next, a plurality of electrical conductive members are secured to a surface of the thin circuitized substrate that is opposite the first surface.
REFERENCES:
patent: 4677528 (1987-06-01), Miniet
patent: 4837184 (1989-06-01), Lin et al.
patent: 5041396 (1991-08-01), Valero
patent: 5045921 (1991-09-01), Lin et al.
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5075760 (1991-12-01), Nakashima et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5352633 (1994-10-01), Abott
patent: 5365655 (1994-11-01), Rose
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5390079 (1995-02-01), Aomori et al.
patent: 5447886 (1995-09-01), Rai
patent: 5450283 (1995-09-01), Lin et al.
patent: 5602059 (1997-02-01), Horiuchi et al.
patent: 5639695 (1997-06-01), Jones et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5661088 (1997-08-01), Tessier et al.
Anon, "Polyimide Preform for Polyimide Film Chip Carrier", Research Disclosure, Nov. 1987, No. 283.
Collins Deven
Fraley Lawrence R.
International Business Machines - Corporation
Picardat Kevin M.
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