Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-06-23
2010-06-01
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S124000, C257SE21502, C257SE21503
Reexamination Certificate
active
07727802
ABSTRACT:
A method for fabricating an electronic component embedded substrate including an electronic component that is embedded within a buildup layer is disclosed. The method includes a first buildup layer lamination step of laminating plural first buildup layers on a core substrate such that the total thickness of the first buildup layers corresponds to the thickness of the electronic component; a cavity formation step of forming a cavity for accommodating the electronic component at the laminated first buildup layers; an accommodating step of accommodating the electronic component within the cavity; and a second buildup layer lamination step of laminating a second buildup layer on the first buildup layers and the electronic component.
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Kenji et al. “Multilayer Circuit Board and Manufacturing Thereof” (May 27, 2004) JP Pub. 2004-153084. Machine English Translation.
Sunohara Masahiro
Ueda Keisuke
Ladas & Parry LLP
Nguyen Khiem D
Shinko Electric Industries Co. Ltd.
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