Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-09-07
2009-12-08
Blum, David S (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S110000, C257SE21501, C257SE23001
Reexamination Certificate
active
07629201
ABSTRACT:
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
REFERENCES:
patent: 5323051 (1994-06-01), Adams et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5757072 (1998-05-01), Gorowitz et al.
patent: 5798557 (1998-08-01), Salatino et al.
patent: 6057597 (2000-05-01), Farnworth et al.
patent: 6214644 (2001-04-01), Glenn
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6297551 (2001-10-01), Dudderar et al.
patent: 6358773 (2002-03-01), Lin et al.
patent: 6376280 (2002-04-01), Ruby et al.
patent: 6380616 (2002-04-01), Tutsch et al.
patent: 6399426 (2002-06-01), Capote et al.
patent: 6402970 (2002-06-01), Lin
patent: 6498114 (2002-12-01), Amundson
patent: 6504096 (2003-01-01), Okubora
patent: 6530515 (2003-03-01), Glenn et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6660564 (2003-12-01), Brady
patent: 6743656 (2004-06-01), Orcutt et al.
patent: 6743991 (2004-06-01), Wong et al.
patent: 6750521 (2004-06-01), Chilcott et al.
patent: 6767764 (2004-07-01), Saia et al.
patent: 6777263 (2004-08-01), Gan et al.
patent: 6787897 (2004-09-01), Geefay et al.
patent: 6794739 (2004-09-01), Kobayashi et al.
patent: 6800508 (2004-10-01), Kimura
patent: 6838309 (2005-01-01), McCann
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 6858929 (2005-02-01), Zuo et al.
patent: 6939784 (2005-09-01), Chen et al.
patent: 6953999 (2005-10-01), Stranberg et al.
patent: 7030494 (2006-04-01), Aoki
patent: 7045459 (2006-05-01), Riedhoff
patent: 7045868 (2006-05-01), Ding et al.
patent: 7059048 (2006-06-01), Konig et al.
patent: 7061099 (2006-06-01), Lu et al.
patent: 7115446 (2006-10-01), Koo et al.
patent: 7169649 (2007-01-01), Rosa et al.
patent: 7198725 (2007-04-01), Shen
patent: 7202560 (2007-04-01), Dungan et al.
patent: 7203388 (2007-04-01), Ha et al.
patent: 7203394 (2007-04-01), Wiegele et al.
patent: 7268436 (2007-09-01), Aigner et al.
patent: 7275424 (2007-10-01), Felton et al.
patent: 7298030 (2007-11-01), McWilliams et al.
patent: 7311242 (2007-12-01), Six
patent: 7319598 (2008-01-01), Steiner et al.
patent: 7323675 (2008-01-01), Chen
patent: 7335972 (2008-02-01), Chanchani
patent: 7368808 (2008-05-01), Heck et al.
patent: 7456497 (2008-11-01), Higashi
patent: 2002/0132463 (2002-09-01), Urushima
patent: 2004/0063249 (2004-04-01), Lin et al.
patent: 2004/0072071 (2004-04-01), Watanabe et al.
patent: 2004/0178492 (2004-09-01), Tsukamoto et al.
patent: 2004/0259325 (2004-12-01), Gan
patent: 2005/0054133 (2005-03-01), Felton et al.
patent: 2005/0139984 (2005-06-01), Tuckerman et al.
patent: 2006/0211233 (2006-09-01), Gan et al.
patent: 2007/0158787 (2007-07-01), Chanchani
patent: 2007/0274058 (2007-11-01), Cousin
patent: 2008/0064142 (2008-03-01), Gan et al.
patent: 2008/0217708 (2008-09-01), Reisner et al.
patent: 2003-218256 (2003-07-01), None
patent: 2006-237406 (2006-09-01), None
patent: 20030088996 (2003-11-01), None
patent: 457657 (2001-10-01), None
patent: 01/19142 (2001-03-01), None
patent: 2008016436 (2008-02-01), None
K. C. Eun et al., “Fully Embedded LTCC Spiral Inductors Incorporating Air Cavity for High Q-factor and SRF,” IEEE Electronic Components and Technology Conference, vol. 1, Jun. 1-4, 2004, pp. 1101-1103.
M. Franosch, “Wafer-Level-Package for Bulk Acoustic Wave (BAW) Filters,” IEEE Microwaves Symposium, vol. 2, Jun. 6-11, 2004, pp. 493-496.
Young Chul Lee et al., “Monolithic LTCC SiP Transmitter for 60GHz Wireless Communication Terminals,” IEEE Microwaves Symposium, Jun. 17, 2005, pp. 1015-1018.
Gan Qing
Liang Steve X.
Lobianco Anthony J.
Warren Robert W.
Blum David S
Lando & Anastasi, LLP.
Skyworks Solutions Inc.
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