Method for fabricating a transformer integrated with a...

Details Method for fabricating a transformer integrated with a... Method for fabricating a transformer integrated with a...

2008-05-06

2008-05-06

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S602100, C029S606000, C310S179000, C310S201000, C310S207000, C310S208000, C336S176000, C336S200000, C336S229000

Reexamination Certificate

active

11278952

ABSTRACT:
A substrate is provided and a top interconnection metal layer and a primary winding layer are formed thereon. Then a passivation layer having a plurality of via exposed parts of the top interconnection metal layer is formed on the substrate. A secondary winding layer and at least a bonding pad are formed on the passivation layer. The bonding pad electrically connects to the top interconnection metal layer through the via.

REFERENCES:
patent: 3614554 (1971-10-01), Shield
patent: 4246044 (1981-01-01), Yanase
patent: 5293025 (1994-03-01), Wang
patent: 5874883 (1999-02-01), Uemura
patent: 6181012 (2001-01-01), Edelstein et al.
patent: 6338974 (2002-01-01), Strnad
patent: 6459135 (2002-10-01), Basteres
patent: 6573822 (2003-06-01), Ma
patent: 6586322 (2003-07-01), Chiu
patent: 6727138 (2004-04-01), Memscap
patent: 6903644 (2005-06-01), Wang et al.
patent: 6998952 (2006-02-01), Zhou
patent: 7262069 (2007-08-01), Chung

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