Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2008-01-22
2008-01-22
Nguyen, Tuyen T. (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
Reexamination Certificate
active
11736565
ABSTRACT:
A substrate is provided and a top interconnection metal layer and a primary winding layer are formed thereon. Then a passivation layer having a plurality of via exposed parts of the top interconnection metal layer is formed on the substrate. A secondary winding layer and at least a bonding pad are formed on the passivation layer. The bonding pad electrically connects to the top interconnection metal layer through the via.
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Chen Yu-Chia
Hsu Tsun-Lai
Hung Cheng-Chou
Liang Victor-Chiang
Tseng Hua-Chou
Hsu Winston
Nguyen Tuyen T.
United Microelectronics Corp.
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