Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-06
2008-05-06
Kim, Paul D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S602100, C029S606000, C310S179000, C310S201000, C310S207000, C310S208000, C336S176000, C336S200000, C336S229000
Reexamination Certificate
active
07367113
ABSTRACT:
A substrate is provided and a top interconnection metal layer and a primary winding layer are formed thereon. Then a passivation layer having a plurality of via exposed parts of the top interconnection metal layer is formed on the substrate. A secondary winding layer and at least a bonding pad are formed on the passivation layer. The bonding pad electrically connects to the top interconnection metal layer through the via.
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Chen Yu-Chia
Hsu Tsun-Lai
Hung Cheng-Chou
Liang Victor-Chiang
Tseng Hua-Chou
Hsu Winston
Kim Paul D.
United Microelectronics Corp.
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