Method for fabricating a through-hole interconnection substrate

Details Method for fabricating a through-hole interconnection substrate Method for fabricating a through-hole interconnection substrate

2007-04-24

2010-10-19

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000, C174S262000, C174S263000, C174S264000

Reexamination Certificate

active

07814651

ABSTRACT:
A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled in the blind hole (3).

REFERENCES:
patent: 3852877 (1974-12-01), Ahn et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5340947 (1994-08-01), Credle et al.
patent: 6460247 (2002-10-01), Gregoire
patent: 6498381 (2002-12-01), Halahan et al.
patent: 6583058 (2003-06-01), Rajendran et al.
patent: 6691408 (2004-02-01), Biron
patent: 4-206875 (1992-07-01), None
patent: 11-168157 (1999-06-01), None
patent: 2002-158191 (2002-05-01), None

Affiliated with

Also associated with

Rating

Method for fabricating a through-hole interconnection substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a through-hole interconnection substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a through-hole interconnection substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4236304