Method for fabricating a through-hole interconnection...

Details Method for fabricating a through-hole interconnection... Method for fabricating a through-hole interconnection...

2007-05-15

2007-05-15

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000, C174S262000

Reexamination Certificate

active

10701635

ABSTRACT:
A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled in the blind hole (3).

REFERENCES:
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5340947 (1994-08-01), Credle et al.
patent: 6460247 (2002-10-01), Gregoire
patent: 6691408 (2004-02-01), Biron
patent: 2002-158191 (2002-05-01), None
Harwley's Condensed chemical Dictionary, 14th Edition, 2002.

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