Method for fabricating a three-dimensional acceleration sensor

Details Method for fabricating a three-dimensional acceleration sensor Method for fabricating a three-dimensional acceleration sensor

2007-07-03

2007-07-03

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C073S514160, C257S414000, C427S079000, C427S080000, C438S050000, C438S051000, C438S052000

Reexamination Certificate

active

11182844

ABSTRACT:
According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.

REFERENCES:
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patent: 5504032 (1996-04-01), Gessner et al.
patent: 6557414 (2003-05-01), Sakurai et al.
patent: 6997054 (2006-02-01), Tsugai
patent: 09061457 (1997-03-01), None
patent: 2004-198243 (2004-07-01), None
“A high performance, variable capacitance accelerometer”; Wilner, L.B.; Instrumentation and Measurement, IEEE transactions on vol. 37, Issue 4; Dec. 1988; pp. 569-571.

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