Method for fabricating a thin film magnetic head and wafer...

Details Method for fabricating a thin film magnetic head and wafer... Method for fabricating a thin film magnetic head and wafer...

2006-08-15

2006-08-15

Wellington, Andrea (Department: 2627)

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

C029S603090, C029S603120, C029S603150

Reexamination Certificate

active

07092212

ABSTRACT:
Leading wires of an electrical circuit and a thin film magnetic head assembly are electrically connected with a conductive film. The leading wires are connected to an element pad and a circuit pad, respectively. An element bump is shared with the electrical circuit and the thin film magnetic assembly. Information of the processing degree of the thin film magnetic head assembly is electrically monitored via the element bump from a bonding pad which is electrically connected with the element bump.

REFERENCES:
patent: 4912883 (1990-04-01), Chang et al.
patent: 5023991 (1991-06-01), Smith
patent: 5597340 (1997-01-01), Church et al.
patent: 5911455 (1999-06-01), Draaisma et al.
patent: 5997381 (1999-12-01), Dee et al.
patent: 6195871 (2001-03-01), Watanuki
patent: 6370763 (2002-04-01), Watanuki et al.
patent: 6609948 (2003-08-01), Fontana et al.
patent: 6747846 (2004-06-01), Kato et al.
patent: 2 262 585 (1972-12-01), None
patent: A 8-287424 (1996-01-01), None
patent: A 2000-187819 (2000-04-01), None

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