Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-08-07
2007-08-07
Olsen, Allan (Department: 1763)
Etching a substrate: processes
Forming or treating thermal ink jet article
C029S890100, C438S021000
Reexamination Certificate
active
11315567
ABSTRACT:
A method for fabricating a thermal inkjet head equipped with symmetrical heaters and a rapid ink refill mechanism and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form a primary ink chamber and an auxiliary ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.
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Chen Chung-Chu
Chung Chen-Kuei
Lin Chun-Jun
Akin Gump Strauss Hauer & Feld & LLP
Industrial Technology Research Institute
Olsen Allan
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