Method for fabricating a temperature compensated surface wave de

Details Method for fabricating a temperature compensated surface wave de Method for fabricating a temperature compensated surface wave de

1976-02-09

1977-02-01

Smith, Alfred E.

Wave transmission lines and networks

Coupling networks

With impedance matching

29 2535, 310 95, 333 72, 427100, H03H 926, H03H 930, H03H 932, H01L 4118

Patent

active

040064352

ABSTRACT:
Disclosed is a method for fabricating an acoustic surface wave device having reduced temperature coefficient of propagation delay within a desired range of operating temperatures. In one embodiment the device includes a piezoelectric substrate comprising X-propagating Y-cut quartz having a cut angle at which point of zero temperature coefficient of propagation delay is at a temperature which is higher than the desired range of operating temperatures. There is included on the substrate in the desired path of the propagating surface wave a deposit of conductive material which has the effect of lowering the temperature at which the point of zero temperature coefficient of propagation delay occurs, thereby reducing the magnitude of the temperature coefficient of propagation delay within the desired range of operating temperatures.

REFERENCES:
patent: 3786373 (1974-01-01), Schulz et al.
patent: 3818382 (1974-06-01), Holland et al.
patent: 3845420 (1974-10-01), Holland et al.

Affiliated with

Also associated with

Rating

Method for fabricating a temperature compensated surface wave de does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a temperature compensated surface wave de, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a temperature compensated surface wave de will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1093784