Method for fabricating a semiconductor structure

Semiconductor device manufacturing: process – Voltage variable capacitance device manufacture

Reexamination Certificate

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C438S340000, C438S328000, C438S202000, C257SE21364, C257SE29344

Reexamination Certificate

active

07449389

ABSTRACT:
A method for fabricating a semiconductor including defining a first component region and a second component region in a semiconductor body is provided. A first epitaxial layer is formed through the first component region. A second epitaxial layer is formed over the first epitaxial layer, including configuring the physical dimensions of a first active zone of the first component region independent of a second active zone of the second component region via the first epitaxial layer and the second epitaxial layer. In one embodiment, the first component is a radio-frequency transistor and the second component is a varactor.

REFERENCES:
patent: 5021859 (1991-06-01), Ito et al.
patent: 5405790 (1995-04-01), Rahim et al.
patent: 5929802 (1999-07-01), Russell et al.
patent: 6806555 (2004-10-01), Huber et al.
patent: 7064416 (2006-06-01), Dunn et al.
patent: 7242071 (2007-07-01), Liu et al.
patent: 7282771 (2007-10-01), Voldman
patent: 2002/0173092 (2002-11-01), Yamaguchi et al.
patent: 2004/0198013 (2004-10-01), Johansson
patent: 2007/0096257 (2007-05-01), Coolbaugh et al.
patent: 04040643 (2004-05-01), None
patent: 03063255 (2005-01-01), None

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