Method for fabricating a semiconductor stripe laser

Fishing – trapping – and vermin destroying

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437 89, 437130, 437133, 437 7, 437227, 148DIG95, 156648, 156649, H01L 2100, H01L 2176

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050266624

ABSTRACT:
A method of undercutting mesa structures in which the lateral extent of the undercut is determined by a prior fabrication stage in which channels (5, 6) are etched and then infilled with a different material. The mesa is formed over the channels (5,6) and a selective etch is used to undercut the mesa, the extent of the undercut (11) being limited by the location of the infilled channels (5, 6). For mechanical stability and insulation the undercuts (11) are filled or partly filled with dielectric (10).

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