Method for fabricating a semiconductor package

Details Method for fabricating a semiconductor package Method for fabricating a semiconductor package

2011-01-11

2011-01-11

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S612000, C438S613000, C438S614000, C257SE21511

Reexamination Certificate

active

07867823

ABSTRACT:
A method for fabricating an IC package that includes depositing conductive adhesive bodies on the leads, and then adhering the electrodes of an IC device to the so disposed conductive adhesive bodies.

REFERENCES:
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6228681 (2001-05-01), Gilleo et al.
patent: 2004/0169275 (2004-09-01), Danvir et al.
patent: 2007/0284758 (2007-12-01), Zhang et al.

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