Method for fabricating a semiconductor device using implantation

Fishing – trapping – and vermin destroying

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437933, 437952, 148DIG24, H01L 21265

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active

054078385

ABSTRACT:
A method for fabricating a semiconductor device including carrying out an ion implantation into a predetermined region of a single-crystal silicon substrate to form therein an amorphized ion-implanted layer according to any one of the methods: (A) implanting an ion of an atom serving as carrier into the predetermined region, followed by implanting an ion of an electrically inert atom or molecule into the region, (B) implanting an ion of an electrically inert atom or molecule in the region, followed by implanting an ion of an atom serving as carrier in the region, and (C) implanting an ion of a molecule in which an atom serving as carrier is bonded to an electrically inert atom; annealing the substrate in an inert atmosphere to crystallize the amorphized ion-implanted layer again; and further annealing the substrate in an oxidizing atmosphere to eliminate defects at the interface of the substrate and the ion implantation layer.

REFERENCES:
patent: 3925106 (1975-12-01), Ku et al.
patent: 4187125 (1980-02-01), Feist
patent: 4584026 (1986-04-01), Wu et al.
patent: 5015593 (1991-05-01), Yawata et al.
patent: 5126278 (1992-06-01), Kodaira

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