Method for fabricating a semiconductor device having a heat...

Details Method for fabricating a semiconductor device having a heat... Method for fabricating a semiconductor device having a heat...

2006-07-18

2006-07-18

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S126000, C438S127000

Reexamination Certificate

active

07078265

ABSTRACT:
A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and scribe lines which are arranged between the device areas. After the heat spreading material is formed on rear surface of the semiconductor wafer, the semiconductor wafer is separated at the scribe lines.

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