Method for fabricating a semiconductor device comprising a polyc

Fishing – trapping – and vermin destroying

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437 20, 437 34, 437 57, 437193, 437956, H01L 21265, H01L 21283

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054591015

ABSTRACT:
A semiconductor device comprising a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a polycide film including a polysilicon layer and a silicide layer formed on the insulating film. The polysilicon layer includes a p-type region having p-type impurities diffused therein and an n-type region having n-type impurities diffused therein. The p-type impurities are implanted into the silicide layer in order to have a substantially uniform concentration over the entire portion thereof, so that the p-type impurities in the p-type region of the polysilicon layer do not diffuse into the silicide film by a post heat treatment.

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"Gallium-Doped Titanium Silicide for Low Contact Resistivity", IBM Tech. Disc. Bull., 29(11), Apr. 1987, pp. 4969-4970.
H. Hayashida et al. "Dopant Redistribution in Dual Gate W-Polycide CMOS and its Improvement by RTA", 1989 Symposium on VLSI Technology; IEEE Cat. No. 89, May 22-25, 1989, pp. 29-30.
"A Fine-Line CMOS Technology that uses P.sup.+ -Polysilicon/Silicide Gates for NMOS and PMOS Devices" by L. C. Parillo et al.; IEDM Dec. 1984, pp. 418-422.
"Technology Limitations for N.sup.+ /P+Polycide Gate CMOS due to Lateral Dopant Diffusion in Silicide/Polysilicon Layers"; by Charles L. Chu et al.; IEEE Electron Device Letters, vol. 12, No. 12; Dec. 1991; pp. 696-698.

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