Method for fabricating a semiconductor device by controlled diff

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29578, 148174, 148187, 148191, 156628, 156649, 156657, 156662, 357 23, 357 24, 357 59, 427 85, 427331, 427333, 4273722, H01L 21225, H01L 2131

Patent

active

042395593

ABSTRACT:
A method for fabricating a semiconductor device is disclosed, which comprises forming a first polycrystalline silicon film containing an impurity such as phosphorus or boron on the surface of a silicon oxide film, forming an impurity-free second polycrystalline silicon film contiguous to the first polycrystalline silicon film, diffusing the impurity contained in the first polycrystalline silicon film into the second polycrystalline silicon film to form an impurity-containing region, and oxidizing the impurity-containing region to electrically separate the first and second polycrystalline silicon films from each other by the resulting oxide.

REFERENCES:
patent: 3738880 (1973-06-01), Laker
patent: 3832247 (1974-08-01), Saddler et al.
patent: 3980507 (1976-09-01), Carley
patent: 4026740 (1977-05-01), Owen
patent: 4057895 (1977-11-01), Ghezzo
patent: 4084987 (1978-04-01), Godber
patent: 4124933 (1978-11-01), Nicholas
patent: 4148054 (1979-04-01), Hart et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a semiconductor device by controlled diff does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a semiconductor device by controlled diff, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a semiconductor device by controlled diff will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-606263

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.