Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2007-10-09
2007-10-09
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S464000, C438S113000, C438S458000, C438S977000
Reexamination Certificate
active
11253558
ABSTRACT:
A method of fabricating a semiconductor device includes the steps of, after sawing a semiconductor substrate into individual semiconductor chips in a state that the semiconductor substrate is covered by an adhesive tape, applying a dry gas to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, applying an infrared radiation to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, and curing the adhesive layer on the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, by irradiating a ultraviolet radiation to the adhesive tape, wherein the step of applying the dry gas, the step of applying the infrared radiation and the said step of curing the adhesive layer are conducted substantially simultaneously.
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Fujitsu Limited
Prasad Neil
Westerman, Hattori, Daniels & Adrian , LLP.
Wilczewski Mary
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