Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-12-27
2005-12-27
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S127000
Reexamination Certificate
active
06979592
ABSTRACT:
A semiconductor apparatus having a semiconductor substrate including an integrated circuit and an insulative base member formed on a main surface thereof. A conductive layer is formed on the main surface of the semiconductor substrate as coupled to the integrated circuit and includes an external portion that extends onto top surface of the base member. A sealing member is formed on the main surface of the semiconductor substrate, the conductive layer and side surfaces of the base member, whereby the extended portion of the conductive layer is exposed from the sealing member.
REFERENCES:
patent: 4654113 (1987-03-01), Tuchiya et al.
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 5382544 (1995-01-01), Matsumoto et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5478778 (1995-12-01), Tanisawa
patent: 5534465 (1996-07-01), Frye et al.
patent: 5534731 (1996-07-01), Cheung
patent: 5659203 (1997-08-01), Call et al.
patent: 5731630 (1998-03-01), Suyama et al.
patent: 5790377 (1998-08-01), Schreiber et al.
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 5834338 (1998-11-01), Takeda et al.
patent: 5859472 (1999-01-01), DiStefano et al.
patent: 5864178 (1999-01-01), Yamada et al.
patent: 5909056 (1999-06-01), Mertol
patent: 5989940 (1999-11-01), Nakajima
patent: 6051489 (2000-04-01), Young et al.
patent: 6136624 (2000-10-01), Kemmochi et al.
patent: 6255737 (2001-07-01), Hashimoto
patent: 6281111 (2001-08-01), Ohsumi
patent: 63-52445 (1988-03-01), None
Fourson George
Oki Electric Industry Co. Ltd.
Toledo Fernando L.
Volentine Francos & Whitt PLLC
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