Method for fabricating a self-aligned metal oxide field effect t

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148186, H01L 2122

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active

040494772

ABSTRACT:
An improved and simplified method of fabricating field effect transistors in metal oxide semiconductor integrated circuits advantageously employs the differential growth rate, under certain temperature conditions, between oxide on silicon wherein phosphorous has been diffused, and on silicon without such diffusion. The improved method of fabrication reduces the number of fabrication steps required, while simultaneously producing field effect transistors with superior operation speeds.

REFERENCES:
patent: 3434021 (1969-03-01), Hofstein
patent: 3442721 (1969-05-01), McCaldin et al.
patent: 3899372 (1975-08-01), Esch et al.
patent: 3910804 (1975-10-01), Alcott

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