Method for fabricating a resistor

Details Method for fabricating a resistor Method for fabricating a resistor

2007-01-23

2007-01-23

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S619000, C029S620000, C029S621000, C338S203000, C338S309000

Reexamination Certificate

active

11037533

ABSTRACT:
An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

REFERENCES:
patent: 5757076 (1998-05-01), Kambara
patent: 6150920 (2000-11-01), Hashimoto et al.
patent: 6304167 (2001-10-01), Nakayama
patent: 03-142904 (1991-06-01), None
patent: 04-102302 (1992-04-01), None
patent: 07-074001 (1995-03-01), None
patent: 07-086012 (1995-03-01), None
patent: 07-245228 (1995-09-01), None
patent: 09-050901 (1997-02-01), None
patent: 09-120902 (1997-05-01), None
patent: 11-016762 (1999-01-01), None
patent: 11-026204 (1999-01-01), None
patent: 11-307304 (1999-11-01), None
Japanese search report for PCT/JP01/00251 dated Apr. 24, 2001.
English translation of Form PCT/ISA/210.
Form PCT/IPEA/408 (Written Opinion).

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