Method for fabricating a printed circuit for DCA semiconductor c

Details Method for fabricating a printed circuit for DCA semiconductor c Method for fabricating a printed circuit for DCA semiconductor c

1994-09-29

1996-06-11

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

29843, 22818022, C25D 502

Patent

active

055252044

ABSTRACT:
Fabricating a printed circuit by forming layers of metallization in a predetermined sequence, where each layer is formed in a predetermined pattern, with a layer of plating formed at selected locations of the printed circuit. Subsequently, forming a layer of insulation over the layers of metallization, except at the selected locations.

REFERENCES:
patent: 4946563 (1990-08-01), Yeatts
patent: 5194137 (1993-03-01), Moore
patent: 5302492 (1994-04-01), Ott
patent: 5316788 (1994-05-01), Dibble
Raymond H. Clark, Handbook of Printed Circuit Manufacturing Van Nostrand Reinhold Co. New York (1985) month unavailable pp. 3-8.

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