Method for fabricating a printed circuit board of desired shape

Details Method for fabricating a printed circuit board of desired shape Method for fabricating a printed circuit board of desired shape

1982-11-29

1985-07-16

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 339 17B, H05K 322

Patent

active

045287481

ABSTRACT:
A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.

REFERENCES:
patent: 3025339 (1962-03-01), Gordon et al.
patent: 3039177 (1962-06-01), Burdett
patent: 3331718 (1967-07-01), Ruffing
patent: 3427715 (1969-02-01), Mika
patent: 3755891 (1973-09-01), Muckelroy et al.
patent: 3879994 (1975-04-01), Hume
patent: 4404237 (1983-09-01), Eichelberger et al.
Memis, I.; Rubino, R. V.; & Wagner, F. O., Bent Thermoset Printed-Circuit Boards, IBM Technical Disclosure Bulletin, vol. 14, No. 11, Apr. 1972.
Hobbs, D. E., "Electrical Connection to Grounded Planes," IBM Tech. Disclosure Bull., vol. 12, No. 5, Oct. 1969.
Iafrate P. F. & Relyea, Jr., "Continuous Processing for Substrate Manufacture", IBM Tech. Disclosure Bull., vol. 15, No. 9, Feb. 1973.

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