Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-12-08
1987-08-25
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29848, 439 83, H05K 334
Patent
active
046883282
ABSTRACT:
A printed circuit board assembly is disclosed which includes a printed circuit board having in situ molded members for mechanically securing electrical and mechanical components and the like to the printed circuit board. The printed circuit board is manufactured using a method wherein a printed circuit board is initially prepared with the required printed circuit patterns and with apertures for in situ molded members and for the leads of the electrical components. The required molded members are then molded in situ in specified apertures of the printed circuit board. The electrical components are thereafter mechanically secured in place with the in situ molded members and the leads of the components are connected to the contact pads of the printed circuit pattern.
REFERENCES:
patent: 2255184 (1941-09-01), Osenberg
patent: 2979554 (1961-04-01), Maitland
patent: 3142783 (1964-07-01), Warren
patent: 3143787 (1964-08-01), Babbe
patent: 3154281 (1964-10-01), Frank
patent: 3428934 (1969-02-01), Reider, Jr. et al.
patent: 3514737 (1970-05-01), Renshaw, Jr.
patent: 3523268 (1970-08-01), Foster
patent: 3543215 (1970-11-01), Jones
patent: 3900239 (1975-08-01), Anhalt et al.
patent: 3947984 (1976-04-01), Winrow
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4050756 (1977-09-01), Moore
patent: 4075395 (1978-02-01), Ohnishi
patent: 4158450 (1979-06-01), Suzuki
patent: 4202091 (1980-05-01), Ohnishi
patent: 4211890 (1980-07-01), Sado et al.
patent: 4219756 (1980-08-01), Nishida et al.
patent: 4254448 (1981-03-01), Martyniak
patent: 4353609 (1982-10-01), Haas
patent: 4361862 (1982-11-01), Martyniak
patent: 4435031 (1984-03-01), Black et al.
patent: 4516816 (1985-05-01), Winthrop
patent: 4573105 (1986-02-01), Beldavs
"New Technique Combines Metals and Plastics", Plastics Design Forum, Mar./Apr. 1976, pp. 19-23.
ICI Victrex-Pes for Moulded Circuit Boards.
Jebens Robert W.
Samuels Gerard
Arbes Carl J.
Echols P. W.
Glick Kenneth R.
RCA Corporation
Tripoli Joseph S.
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