Method for fabricating a printed circuit board

Details Method for fabricating a printed circuit board Method for fabricating a printed circuit board

2006-10-24

2008-11-18

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S840000, C029S847000, C427S096100

Reexamination Certificate

active

07451540

ABSTRACT:
Fabricating (100, 1300) a printed circuit board includes fabricating patterned conductive traces (305, 310, 1410, 1415) onto a foil, laminating the patterned conductive traces to a printed circuit board substrate (405, 1505) by pressing on the foil, such that the conductive traces are pressed into a dielectric layer of the printed circuit board, and removing the foil to expose a co-planar surface of conductive trace surfaces and dielectric surfaces. Removal may be done by peeling (125) and/or etching (130, 1315).

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