Method for fabricating a plurality of semiconductor bodies

Details Method for fabricating a plurality of semiconductor bodies Method for fabricating a plurality of semiconductor bodies

1998-09-21

2000-08-08

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

438113, H01L 2100

Patent

active

06100104&

ABSTRACT:
A plurality of semiconductor bodies are produced by first depositing a mask layer on a main surface of a substrate wafer. A plurality of windows are next formed in the mask layer such that the wafer surface is laid bare in the windows. A semiconductor layer sequence defining the semiconductor bodies functionally is then deposited onto the main surface in the windows. Finally, the wafer is divided and severed into individual semiconductor chips.

REFERENCES:
patent: 5013682 (1991-05-01), Plumton et al.
patent: 5284791 (1994-02-01), Sakada et al.
patent: 5478774 (1995-12-01), Ackley et al.
Japanese Patent Abstract No. 05251738 (Toyotoshi), dated Sep. 28, 1993.
Japanese Patent Abstract No. 08046291 (Seiji), dated Feb. 16, 1996.
Japanese Patent Abstract No. 07122520 (Shuji), dated May 12, 1995.
Japanese Patent Abstract No. 09045987 (Toshiaki), dated Feb. 14, 1997.

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