Method for fabricating a photomask for an integrated circuit...

Joints and connections – Inflatable connector

Reexamination Certificate

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Reexamination Certificate

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07073969

ABSTRACT:
A method for fabricating a photomask for an integrated circuit. The method includes, for example, providing a substrate with at least one trench, providing a prepatterned surface at the bottom of the trench, and providing a multilayer coating over the substrate. As a result, the multilayer coating forms a reflection region on the surface of the substrate outside the trench and a non-reflection region in the trench. The invention additionally provides a corresponding photomask.

REFERENCES:
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patent: 6607862 (2003-08-01), Yan et al.
patent: 6919146 (2005-07-01), Corliss et al.
Hong et al. “Protection of SrBi2Ta2O9ferroelectric capacitors from hydrogen damage by optimized metallization for memory applications” Apply. Physics Letters, vol. 77, No. 1, Jul. 2000, pp. 76-78.

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