Method for fabricating a packaging substrate

Details Method for fabricating a packaging substrate Method for fabricating a packaging substrate

2011-06-21

2011-06-21

Ahmed, Shamim (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S041000, C216S095000, C216S096000, C438S106000, C438S108000, C029S846000, C029S854000

Reexamination Certificate

active

07964106

ABSTRACT:
A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion.

REFERENCES:
patent: 5778529 (1998-07-01), Beilin et al.
patent: 2005/0186705 (2005-08-01), Jackson et al.
patent: 2008/0122079 (2008-05-01), Chen et al.
patent: I252721 (2006-04-01), None
patent: I258828 (2006-07-01), None

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